Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Dai, Wen; Yu, Jinhong; Liu, Zhiduo; Wang, Yi; Song, Yingze; Lyu, Jilei; Bai, Hanying; Nishimura, Kazuhito; Jiang, Nan

doi:10.1016/j.compositesa.2015.05.017

Cited by 143 publications

(47 citation statements)

References 47 publications

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“…Graphene has drawn more attention as a kind of thermal conductive fillers due to its high thermal conductivity [73][74][75][76][77]. It is reported that the improved interfacial interaction between functionalized graphene and the matrix can reduce the thermal barrier and enhance the heat flow [78,79].…”

Section: Thermal Conductivitymentioning

confidence: 99%

A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

Chen

Wang

et al. 2016

Composites Part A: Applied Science and Manufacturing

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Section: Thermal Conductivitymentioning

confidence: 99%

A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

Chen

Wang

et al. 2016

Composites Part A: Applied Science and Manufacturing

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“…Polyimides (PIs), with a low dielectric constant and high thermal stability and storage modulus, have been widely used as the electronic packaging materials. However, their intrinsic thermal conductivity is very low, only in the range of 0.1–0.4 W mK –1 . Therefore, various highly thermal conductive fillers, including metals or metal oxides (silver nanowires, zinc oxide, aluminium oxide, etc.…”

Section: Figurementioning

confidence: 99%

Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks

Ding

Wang

et al. 2019

Macromol. Rapid Commun.

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Easy and high efficient methods are in great demand to obtain polyimide (PI) composites with high thermal conductivity in the electronic packaging field. In this work, PI/boron nitride (BN) composites with high thermal conductivity are easily fabricated. Tightly connected and well‐arranged BN platelets construct effective 3D thermally conductive networks in the PI matrix upon hot pressing, after BN platelets are coated on the surface of PI granules by the help of a kind of PI adhesive. The thermal conductivity of the PI/BN composites reaches as high as 4.47 W mK–1 at a low BN loading of 20 vol%, showing an enhancement of 2099%, compared to pure PI. Such enhancement of the thermal conductivity is the highest compared with the results in the open literature. Our work is a good example that utilized the sufficient physical connection (aggregates) of thermally conductive fillers to significantly promote the thermal conductivity of polymer composites.

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“…In Fig. d, if measured by the TC enhancement of filler, it could be calculated that the value was 201, which was one of the highest result at a relatively low filler loading among the previous research focused on the thermal conductive polymeric composites to our best knowledge .…”

Section: Resultsmentioning

confidence: 84%

Boron nitride‐graphene sponge as skeleton filled with epoxy resin for enhancing thermal conductivity and electrical insulation

Guo

Wang

et al. 2019

Polymer Composites

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3D Graphene sponge (GS) supported boron nitride (BN) skeleton (BN@GS) was fabricated through a facile method by using ammonium sulfide under mild conditions. Then, BN@GS sponge was infiltrated by epoxy resin to prepare the composites. The microstructures of BN@GS were controlled by adjusting the mass ratio of GS to BN and the dimension of BN to obtain thermally conductive but electrically insulating polymer composites. The thermal and electrical properties of composites were investigated and the results showed that thermal conductivity of composites reached 0.588 W m−1 K−1 at a low GS loading of 0.157 wt%, which was twice as large as the BN/epoxy composites without graphene. When the mass ratio of BN to GS was 60:1 and 100:1, the electrical conductivity of the resin composites corresponded to insulator region. The 3D continuous network of GS endowed the composites with enhanced thermal conductivity at a relatively low filler loading. In addition, the introduction of BN cut off the transmission of electrons which resulted in the composites with electrical insulation. The hybrid fillers were introduced to guarantee the enhanced thermal conductivity and electrical insulation at a relatively low filler loading. The thermal conductivity of the BN@GS/epoxy composites coincide well with the surface temperature variation of the BN@GS/epoxy composites acquired from an infrared camera. The mechanical properties of BN@GS/epoxy composites improved remarkably in comparison with pure epoxy resin. POLYM. COMPOS., 40:E1600–E1611, 2019. © 2019 Society of Plastics Engineers

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Enhanced thermal conductivity and retained electrical insulation for polyimide composites with SiC nanowires grown on graphene hybrid fillers

Cited by 143 publications

References 47 publications

A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

A facile assembly of polyimide/graphene core–shell structured nanocomposites with both high electrical and thermal conductivities

Highly Thermally Conductive Polyimide Composites via Constructing 3D Networks

Boron nitride‐graphene sponge as skeleton filled with epoxy resin for enhancing thermal conductivity and electrical insulation

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