“…The previously reported works on the growth mechanism of SiC thin films on Si substrate proposed that the void formation at SiC/Si interface is attributed to the out-diffusion of silicon atoms along ͓111͔ planes and is greatly dependent on precursor concentration, growth pressure, temperature, and time. 20,21 They also suggested that this rough SiC/Si interface causes the formation of microholes at the SiC film surface. However, when the SiC films grew on Si surfaces nitrided for 30, 60, and 90 min, smooth and planar surfaces were observed from the SiC films without the generation of triangular etch pits.…”