Proceedings of 2001 International Symposium on Electrical Insulating Materials (ISEIM 2001). 2001 Asian Conference on Electrica
DOI: 10.1109/iseim.2001.973708
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Fabrication of hafnium silicate films by plasma-enhanced chemical vapor deposition

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“…1 High-k materials have been reported to reduce the gate leakage current and to boost scale-down devices. [2][3][4][5] Cerium dioxide ͑CeO 2 ͒ has suitable chemical stability properties and a high dielectric constant of 26. Furthermore, owing to a lattice mismatch as small as 0.35% with Si, CeO 2 is a material with the potential to reduce the defect densities at the interface.…”
mentioning
confidence: 99%
“…1 High-k materials have been reported to reduce the gate leakage current and to boost scale-down devices. [2][3][4][5] Cerium dioxide ͑CeO 2 ͒ has suitable chemical stability properties and a high dielectric constant of 26. Furthermore, owing to a lattice mismatch as small as 0.35% with Si, CeO 2 is a material with the potential to reduce the defect densities at the interface.…”
mentioning
confidence: 99%