Fault localization by Dynamic Laser Stimulation extended testing

Perdu, Philippe

doi:10.1109/ipfa.2009.5232671

Cited by 5 publications

(1 citation statement)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…22) In addition to the first results, we can consider a sensitivity extension by using Lock-in amplification. All the thermal laser stimulation techniques, static and dynamic [13,14], can be adapted to SiP with this thermal light stimulation. It includes some ability to detect defects when they are optically accessible, even through a PCB.…”

Section: Resistive Pathmentioning

confidence: 99%

Facing more than moore, is magnetic microscopy the new Swiss knife for 3D defect localization in SiP?

Perdu

Infante

2010

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

Self Cite

View full text Add to dashboard Cite

So far, most of the defects at system level are assembly related. This trend obviously concerns Systems in Package, Stacked dies, Packages on Package devices, passive integration, integration of logic, power, wireless, analog, sensor and actuator in the same packaged device… All these Systems in Package defy our failure localization tools. For the first time, we have to face non transparent material, massive 3D structure with mandatory long working distance and need of relatively high spatial resolution. Magnetic microscopy has the ability do this as long as we are able to adapt its principle to the mandatory 3D sensitivity and resolution. We have developed a global 3D approach based on simulation in order to target µm resolution at long working distance.

show abstract

Section: Resistive Pathmentioning

confidence: 99%