1985
DOI: 10.1109/edl.1985.26162
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High-quality GaAs MESFET's grown on Silicon substrates by molecular-beam epitaxy

Abstract: High-quality epitaxial films of 2.3-pm-thick GaAs were grown on 3-in-diam(100) Si substrates misoriented by 4 " toward (110). The total morphological defect density observed was (2000 cm-') comparable to what is obtained on a typical GaAs grown on GaAs in this particular MBE process. The electron mobilities and doping levels were 3350 cm'/V.s and 3 x .lo'' ~m -~, which are comparable to GaAs on GaAs of equivalent parameter MESFET's with a A-pm gate lengths, exhibited good saturation and pinch off, no observals… Show more

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Cited by 39 publications
(6 citation statements)
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“…The insight gained from studying this material could aid the conception and optimization of other hetero-epitaxial systems. The APB problem has been fairly successfully resolved by the use of misoriented Si substrates in conjunction with high-temperature pre-bake treatment [36][37][38]. Beginning with a 4-6°o ffcut Si substrate tilted toward the [110] direction, single atomic steps tend to reorganize into energetically more stable double steps under high-temperature annealing conditions [39].…”
Section: Wafer-scale Hetero-epitaxial Growth Of Iii-v Thin Ilms On Simentioning
confidence: 99%
“…The insight gained from studying this material could aid the conception and optimization of other hetero-epitaxial systems. The APB problem has been fairly successfully resolved by the use of misoriented Si substrates in conjunction with high-temperature pre-bake treatment [36][37][38]. Beginning with a 4-6°o ffcut Si substrate tilted toward the [110] direction, single atomic steps tend to reorganize into energetically more stable double steps under high-temperature annealing conditions [39].…”
Section: Wafer-scale Hetero-epitaxial Growth Of Iii-v Thin Ilms On Simentioning
confidence: 99%
“…It is well known that the use of offcut Si substrates with various angles from 4° to 7° is effective in suppression of the formation of APBs [100][101][102][103]. As mentioned in Section 2.1, the monatomic steps of the Si(001) surface consist of two alternating (2 × 1) and (1 × 2) dimerization.…”
Section: Offcut Silicon Substratesmentioning
confidence: 99%
“…If properly baked, this surface is reconstructed, exhibiting mostly double layer, in many cases D A -like steps. For MBE growth, up to now, mainly vicinal Si(001) surfaces, which are offcut by 4 or 6 in one of the h110i directions, respectively, were used [67][68][69][70][71][72]. In this study, similar annealing conditions to those mentioned above were applied.…”
Section: Si Surface Preparationmentioning
confidence: 99%