Improvements in the reliability and manufacturability of an integrated RF power amplifier module system-in-package, via implementation of conductive epoxy adhesive for selected SMT components

Cavasin, Daniel; Brice-Heames, K.; Arab, A. Hadj

doi:10.1109/ectc.2003.1216478

Cited by 5 publications

(1 citation statement)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Ag is the most common conductive fillers for ICA, due to its high conductivity and easy processing, but its high cost is one of the drawbacks for wide use of Ag-filled ICAs. ICAs have been used for die attach adhesives, 3 adhesives in surface mount technology (SMT), 4,5 and flip chip 6 and other applications. Figure 1 shows the schematics of SMT and flip chip components assembled by ICA joints instead of solder joints.…”

Section: Introductionmentioning

confidence: 99%

Oxidation Prevention and Electrical Property Enhancement of Copper-Filled Isotropically Conductive Adhesives

Yim

Moon

et al. 2007

Journal of Elec Materi

View full text Add to dashboard Cite

This paper describes the development and characterization of isotropically conductive adhesives (ICAs) incorporating copper (Cu) powders as electrically conductive fillers, along with a silane coupling agent for oxidation protection of copper powders, for environmentally friendly, low cost and high thermal reliability applications in microelectronics packaging. The effect of silane coupling agent materials and concentration on the electrical conductivity, thermal stability and reliability of Cu-filled ICAs was investigated for potential alternatives of conventional silver-filled ICAs. The surface characteristics of silane thin films on copper surfaces, such as their hydrophobicity and thermal stability, were also evaluated to compare the performance of antioxidant behaviors of different silane coupling agents for Cu-filled ICAs. The low contact resistance and high thermal stability of the contact resistance of Cufilled ICAs were achieved by addition of an optimized silane coupling agent. Greater thermal stability and improved reliability of Cu-filled ICAs under high temperature and humidity conditions were achieved with a silane coupling agent of high molecular weight and hydrophobicity. The bulk resistivity of~10-4 Xcm of Cu-filled ICAs was achieved with bimodal filler loading.

show abstract