In situ measurement of bond resistance varying with process parameters during ultrasonic wedge bonding

Investigation of the thermal properties of thin solid materials at different temperature levels using a set of microresistors

“…Bonding wires made of gold of few millimeters in length and 25 mm in diameter connect the pads with PCB 2. As reported by Ji et al [32], the electrical resistances of the bonding wires and the bond interfaces do Fig. 6.…”