1999
DOI: 10.1016/s0927-0248(99)00013-6
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Investigation of the M/a-Si:H/c-Si structure as a Schottky contact with a diffusion barrier layer

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Cited by 4 publications
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“…In general a thin n + a-Si:H layer is sandwiched between the metal and a-Si:H layers to make the contact ohmic [1]. But this process is an extra undesired step therefore electrical properties of variety of metal/ a-Si:H ohmic contacts were investigated by researchers [2,3]. For example, Sb is sandwiched between the metal and a-Si:H as a thin layer instead of n + a-Si:H layer [4].…”
Section: Introductionmentioning
confidence: 99%
“…In general a thin n + a-Si:H layer is sandwiched between the metal and a-Si:H layers to make the contact ohmic [1]. But this process is an extra undesired step therefore electrical properties of variety of metal/ a-Si:H ohmic contacts were investigated by researchers [2,3]. For example, Sb is sandwiched between the metal and a-Si:H as a thin layer instead of n + a-Si:H layer [4].…”
Section: Introductionmentioning
confidence: 99%