2005
DOI: 10.1016/j.sse.2005.10.017
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Low voltage and low power embedded 2T-SONOS flash memories improved by using P-type devices and high-K materials

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Cited by 17 publications
(6 citation statements)
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“…Due to its promising in terms of scalability, the conventional polycrystalline silicon/oxide/ nitride/oxide/silicon memory cell has regained a lot of attention nowadays. 2,3 Typical fabrication of the oxide/nitride/oxide ͑ONO͒ stack consists in the growth of a thin SiO 2 layer on a Si substrate and subsequent deposition of a Si 3 N 4 layer. The top silicon oxide is obtained by either deposition techniques or high temperature wet oxidation 4,5 of the Si 3 N 4 layer.…”
mentioning
confidence: 99%
“…Due to its promising in terms of scalability, the conventional polycrystalline silicon/oxide/ nitride/oxide/silicon memory cell has regained a lot of attention nowadays. 2,3 Typical fabrication of the oxide/nitride/oxide ͑ONO͒ stack consists in the growth of a thin SiO 2 layer on a Si substrate and subsequent deposition of a Si 3 N 4 layer. The top silicon oxide is obtained by either deposition techniques or high temperature wet oxidation 4,5 of the Si 3 N 4 layer.…”
mentioning
confidence: 99%
“…Note that the memory devices presented in this paper are meant to be used in twotransistor (2T) NOR and E 2 PROM configurations, where a select gate in each cell ensures immunity to over-erase. In such a 2T-configuration negative erased V T such as those shown in figure 5 are even an advantage as they enable low-voltage read [5]. Threshold voltages in the programmed state are given by the curves with filled symbols, whereas the curves with open symbols display the threshold voltages in the erased state.…”
Section: Device Fabrication and Characterizationmentioning
confidence: 99%
“…In addition, SONOS memories are particularly attractive for embedded applications, as they considerably facilitate integration, simplifying it to a single-poly process. However, SONOS memories aimed at low power and low voltage applications, programmed/erased by direct tunnelling of charge from the silicon (Si) channel with moderately low programme/erase (P/E) voltages V P /E ∼ = ±10 V, suffer from inherent retention problems [3][4][5]. Efficient programming and, in particular, erasing by tunnelling are only possible if the bottom silicon dioxide SiO 2 is sufficiently thin, typically around 2-2.5 nm.…”
Section: Introductionmentioning
confidence: 99%
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