Nanowire-filled polymer composites with ultrahigh thermal conductivity

Balachander, Nikhil; Seshadri, Indira; Mehta, Rutvik J.; Schadler, Linda S.; Borca-Tasciuc, Theo; Keblinski, Pawel; Ramanath, Ganpati

doi:10.1063/1.4793419

Cited by 80 publications

(54 citation statements)

References 26 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…While metals are sometimes described as bad fillers due to low TC of their composites compared with other fillers , it should be noted that in most of the reported experiments, the metals were powders, likely more or less spherical shaped, thus possessing a low AR. Nikhil et al showed that composites with gold nanofibers can display a TC of 5 W m −1 K −1 , even at filler amounts as low as 3 m%. Park et al indicated that by changing the shape of copper from sphere‐like to flake‐like an increase in TC can be noticed as well.…”

Section: Relevance Of Materials Propertiesmentioning

confidence: 99%

The relevance of material and processing parameters on the thermal conductivity of thermoplastic composites

Wieme

Tang

Delva

et al. 2017

Polymer Engineering & Sci

View full text Add to dashboard Cite

Thermoplastics composites show vast promise as an alternative for thermal management applications in the scope of the development of next-generation electronics and heat exchangers. Their low cost, reduced weight, and corrosion resistance make them an attractive replacer for traditionally used metals, in case their thermal conductivity (TC) can be sufficiently increased by designing the material (e.g., filler type and shape) and processing (e.g., dispersion quality, mixing, and shaping) parameters. In the present contribution, the relevance of both types of parameters is discussed, and guidelines are formulated for future research to increase the TC of thermoplastic polymer composites. POLYM. ENG. SCI., 58:466-474, 2018.

show abstract

Section: Relevance Of Materials Propertiesmentioning

confidence: 99%

The relevance of material and processing parameters on the thermal conductivity of thermoplastic composites

Wieme

Tang

Delva

et al. 2017

Polymer Engineering & Sci

View full text Add to dashboard Cite

show abstract

“…Both particle–matrix ( R pm ) and particle–particle interfaces ( R pp ) contribute to R b , but the limiting thermal boundary resistance shifts from R pm to R pp when significant percolating networks are established and particle–particle contact is significantly increased . Furthermore, R pp can be reduced when using silver fill particles through welding or mechanical sintering . These processes are enabled by the soft, nearly oxide‐free silver surfaces and can lead to a 40‐fold improvement in k c .…”

Section: Introductionmentioning

confidence: 99%

Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering

Ralphs

Kong

Wang

et al. 2019

Adv Materials Inter

View full text Add to dashboard Cite

Despite major advancements in the performance of thermal interface materials (TIMs), contact resistance between components persists as a major thermal bottleneck in electronics packaging. In this work, the thermal performance of composite TIMs is enhanced through a synergistic coupling of magnetic alignment and engineered particle coatings that reduce the thermal resistance between particles. By itself, magnetically induced percolation of nickel particles within a cross‐linked silicone matrix doubles the thermal conductivity of the composite. This process significantly increases contact between particles, making the interfacial particle–particle resistance a major contributor to the composites thermal performance. The resistance at these interfaces can be reduced by introducing soft metal (silver) or liquid metal coatings onto the nickel particles. Compressing powder beds of these hybrid particles reveals that, dependent on coating thickness, the contact engineering approach provides multifold increases in thermal conductivity at mild pressures. When dispersed in a polymer matrix and magnetically aligned, the coated particles provide a threefold increase in composite thermal conductivity, as compared to unaligned samples (up to nearly 6 W m−1 K−1 with volumetric fill fraction of 0.5). For equivalent coating thicknesses, silver coatings achieve better performance than liquid metal coatings.

show abstract

“…[10][11][12][13][14][15] Moreover, metallic particles 40 were introduced in carbon/polymer composites to develop conducting pathways in addition to those by carbon fillers, thereby improving the TC. 6,7,13,14,[19][20][21][22][23][24][25][26][27][28] For example, individual dispersion of fillers in the polymer matrix is necessary but insufficient for high TC composites since each filler was completely covered with polymer chains, rendering it 50 very difficult to transfer heat. S1 †).…”

Section: Introductionmentioning

confidence: 99%

Self-assembled block copolymer micelles with silver–carbon nanotube hybrid fillers for high performance thermal conduction

Choi

Jung

et al. 2015

Nanoscale

View full text Add to dashboard Cite

The development of polymer-filled composites with an extremely high thermal conductivity (TC) that is competitive with conventional metals is in great demand due to their cost-effective process, light weight, and easy shape-forming capability. A novel polymer composite with a large thermal conductivity of 153 W m(-1) K(-1) was prepared based on self-assembled block copolymer micelles containing two different fillers of micron-sized silver particles and multi-walled carbon nanotubes. Simple mechanical mixing of the components followed by conventional thermal compression at a low processing temperature of 160 °C produced a novel composite with both structural and thermal stability that is durable for high temperature operation up to 150 °C as well as multiple heating and cooling cycles of ΔT = 100 °C. The high performance in thermal conduction of our composite was mainly attributed to the facile deformation of Ag particles during the mixing in a viscous thermoplastic medium, combined with networked carbon nanotubes uniformly dispersed in the nanoscale structural matrix of block copolymer micelles responsible for its high temperature mechanical stability. Furthermore, micro-imprinting on the composite allowed for topographically periodic surface micropatterns, which offers broader suitability for numerous micro-opto-electronic systems.

show abstract

Nanowire-filled polymer composites with ultrahigh thermal conductivity

Cited by 80 publications

References 26 publications

The relevance of material and processing parameters on the thermal conductivity of thermoplastic composites

The relevance of material and processing parameters on the thermal conductivity of thermoplastic composites

Thermal Conductivity Enhancement of Soft Polymer Composites through Magnetically Induced Percolation and Particle–Particle Contact Engineering

Self-assembled block copolymer micelles with silver–carbon nanotube hybrid fillers for high performance thermal conduction

Contact Info

Product

Resources

About