2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) 2022
DOI: 10.1109/vlsi-tsa54299.2022.9771015
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Neuromorphic Computing with Fe-FinFETs in the Presence of Variation

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Cited by 19 publications
(14 citation statements)
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“…The CMOS compatibility and the low process temperature of hafnium zirconium oxide (HZO) make HZO-based ferroelectric (Fe) finFETs an excellent candidate for logic, memory, and neuromorphic devices. This property can be attributed to its superior endurance and write speed compared to flash, significantly higher on-to-off current ratio than that of MRAM, as well as the negligible impact of random telegraphic noise from charge-based operation, unlike RRAM [30][31][32][33][34][35][36][37]. However, the pivotal issue lies in the increasing stochasticity with scaling and the inherent charge-trapping sites that can capture electrons or holes from the channel side (CS) or the gate side (GS).…”
Section: Ferroelectricity In Hafnium Oxidementioning
confidence: 99%
“…The CMOS compatibility and the low process temperature of hafnium zirconium oxide (HZO) make HZO-based ferroelectric (Fe) finFETs an excellent candidate for logic, memory, and neuromorphic devices. This property can be attributed to its superior endurance and write speed compared to flash, significantly higher on-to-off current ratio than that of MRAM, as well as the negligible impact of random telegraphic noise from charge-based operation, unlike RRAM [30][31][32][33][34][35][36][37]. However, the pivotal issue lies in the increasing stochasticity with scaling and the inherent charge-trapping sites that can capture electrons or holes from the channel side (CS) or the gate side (GS).…”
Section: Ferroelectricity In Hafnium Oxidementioning
confidence: 99%
“…Among many emerging memory technologies like resistive random access memory (ReRAM) and phase change memory (PCM), ferroelectric field effect transistors (FeFETs) seem to be the most promising ones. The pronunciation of ferroelectricity in a single-layer thin film of hafnium oxide (HfO 2 ), fast switching, high on-current ( I ON ) to off-current ( I OFF ) ratio ( I O N I O F F ) , excellent linearity in synaptic weight updates, bidirectional operation, and good endurance are the key technological factors that make FeFET superior to other methods. , ,, However, the primary bottleneck in implementing the FeFET-based computing system lies in the intrinsic stochasticity owing to the polycrystalline nature of HfO 2 -based ferroelectric thin film, as well as inherent defect sites that may capture electrons or holes from the channel side (CS) or gate side (GS). Numerous efforts have been made to reduce the impacts of such nonidealities from the device process, and a circuit point of view. ,, Previously, it has been reported how the quality of the interface and the READ -Voltage play a pivotal role in the performance of FeFETs, especially for low-frequency noise response, retention, and endurance. ,,,,− In this work, we aim to maximize the reliability and performance of FeFETs by adopting a synergistic approach of READ -voltage optimization and interfacial-layer engineering.…”
Section: Introductionmentioning
confidence: 99%
“…ECENT progress in researching hafnium oxide (HfO2) based ferroelectric (Fe) materials has manifested its potential as emerging non-volatile memories. The compatibility of the FeFET process with the CMOS process and the demonstration of 28nm HKMG FeFET [1][2][3][4], ferroelectric finfield effect transistors (Fe-finFET) [5,6], and ferroelectric thin film transistors (Fe-TFT) [7,8] have paved the way for highdensity FeFET based memory array. Amidst many developments, the device-to-device in the drain current (∆Id D2D ) of the FeFETs, especially in the low-threshold voltage (LVT) state, creates a significant bottleneck in the wafer-scale operation of the FeFET-based memory array [9][10][11][12][13][14][15].…”
Section: Introductionmentioning
confidence: 99%