Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling

Lee, Alvin; Su, Jay; McCutcheon, Jeremy; Wang, Bor Kai; Tsai, Leon; Shorey, Aric

doi:10.1109/eptc.2012.6507100

Cited by 7 publications

(2 citation statements)

References 1 publication

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“…The first generation of temporary bonding materials was used for the thermal slide debonding process, such as Space Liquid from Nikka Seiko, HT series materials from Brewer Science [27][28][29][30][31], JSR [32], etc. ; as the application scenarios changed, materials and techniques for debonding using solvents (e.g., Zero Newton temporary debonding system from TOK [33,34]), mechanical forces (e.g., BrewerBOND ® 305) [35] or lasers (e.g., 3M WSS [36], HD-3007 from HDMS [23], BrewerBOND ® 701 [37][38][39]) to release were developed. Special technologies such as ZoneBOND ® [40] and air-jetting were developed [41,42].…”

Section: Introductionmentioning

confidence: 99%

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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Temporary bonding/debonding (TBDB) technologies have greatly contributed to the reliable fabrication of thin devices. However, the rapid development of large-scale, high-precision and ultra-thin devices in the semiconductor field has also proposed more stringent requirements for TBDB technologies. Here, we deliberate the recent progress of materials for temporary bonding and different debonding technologies over the past decade. Several common debonding methods are described, including thermal slide, wet chemical dissolution, mechanical peeling and laser ablation. We review the current status of different debonding technologies and highlight the applications of TBDB technologies in advanced electronic packaging. Possible solutions are proposed for the challenges and opportunities faced by different TBDB technologies. Ultimately, we attempt to propose an outlook on their future development and more possible applications. We believe that the simple schematics and refined data presented in this review would give readers a deep understanding of TBDB technologies and their vast application scenarios in future advanced electronic packaging.

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Section: Introductionmentioning

confidence: 99%

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Wang

et al. 2023

Electronics

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“…The bonding material must be compatible with surface materials as well as good step coverage to void-free bonding [3]. Most importantly, the bonding material shall remain stable and good resistance in harsh thermal and chemical environments to protect interposer at all time [4]. The thermal stability and characteristics of the bonding material used in this study as shown in Figure 2, is important to maintain low warp.…”

Section: Introductionmentioning

confidence: 99%

Laminating thin glass onto glass carrier to eliminate grinding and bonding process for glass interposer

Tsai¹,

Wang²,

Shorey³

et al. 2014

2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)

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Interposer fabrication processes are critical techniques in 3D-IC integration, providing the short interconnection among different stacked chips and the substrate [1]. Nowadays, silicon is a mature material in semiconductor technology, but glass, a dielectric material, provides an attractive option due to its intrinsic characteristics for the advantages of electrical isolation, better RF performance, flexibility with CTE as well as the ability to provide a low cost solution [2].In this investigation, another cost reduction concept of through glass via (TGV) wafer processing is being studied. By leveraging current semiconductor equipment and knowhow, we bond TGV wafers onto glass carriers as shown in Figure 1, the TGV wafer thickness is directly 100um and center diameter (CD) of through glass via is 30 m. This approach provides a method to temporarily bond these TGV wafers to glass carriers enabling handling through processes such as via fill and surface metallization. The ability to form glass at the target 100 um thickness and provide through holes and thus avoid backgrinding processes provides substantial opportunity to save costs and avoid yield loss.

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Introduction to Flexible Glass Substrates

Garner

Huang

2017

Flexible Glass

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Optimization of temporary bonding through high-resolution metrologies to realize ultrathin wafer handling

Cited by 7 publications

References 1 publication

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Temporary Bonding and Debonding in Advanced Packaging: Recent Progress and Applications

Laminating thin glass onto glass carrier to eliminate grinding and bonding process for glass interposer

Introduction to Flexible Glass Substrates

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