Optimized cooling systems for high-power semiconductor devices

Baumann, Heinrich; Heinemeyer, P.; Staiger, W.; Topfer, M.; Unger, K.; Müller, Dietmar

doi:10.1109/41.915408

Cited by 17 publications

(15 citation statements)

References 2 publications

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“…For cooling efficiency improvements, numerous advancements to the interfacial thermal layers of the package have been investigated [7]- [9]. These concepts include direct mounting of the power stage on a cold plate [10], which eliminates the bulky Cu base plate and in turn removes thermal barriers from the package stack.…”

Section: Introductionmentioning

confidence: 99%

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Liang

Ning

Wang

et al. 2014

IEEE J. Emerg. Sel. Topics Power Electron.

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A multilayer planar interconnection structure was used for the packaging of liquid-cooled automotive power modules. The power semiconductor switch dies are sandwiched between two symmetric substrates, providing planar electrical interconnections and insulation. Two minicoolers are directly bonded to the outside of these substrates, allowing doublesided, integrated cooling. The power switch dies are orientated in a face-up/face-down 3-D interconnection configuration to form a phase leg. The bonding areas between the dies and substrates, and the substrates and coolers are designed to use identical materials and are formed in one heating process. A special packaging process has been developed so that high-efficiency production can be implemented. Incorporating high-efficiency cooling and low-loss electrical interconnections allows dramatic improvements in systems' cost, and electrical conversion efficiency. These features are demonstrated in a planar bond-packaged prototype of a 200 A/1200 V phase-leg power module made of silicon (Si) insulated gate bipolar transistor and PiN diodes.

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Section: Introductionmentioning

confidence: 99%

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Liang

Ning

Wang

et al. 2014

IEEE J. Emerg. Sel. Topics Power Electron.

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“…This strategy simplifies the coolant pumping and the heat transfer by avoiding the cost, operation reliability, and complexity problems linked to conventional liquid-pumping systems (Baumann et al, 2001). One particular case of these cooling systems is the convection-forced heat pipe-based thermosyphon investigated in this work (see Fig.…”

Section: Thermosyphon Cooling System Descriptionmentioning

confidence: 99%

“…Besides, IGBT modules are also the most sensitive elements to other system failures. For instance, dysfunctions on the IGBT drivers (Bouscayrol et al, 2006;Steimel, 2004), on the sensing elements to monitor the critical electrical and thermal variables of the inverter (Bose, 2006), on the cooling system (Baumann et al, 2001), and on the capacitors (decoupling or filter) (Malagoni-Buiatti et al, 2010) undoubtedly lead to their destruction (induced-failures). Furthermore, their working conditions can be more adverse when the IGBT power module wears out (Lhommeau et al, 2007), a non-optimum thermal management design has been carried out (Perpiñà et al, 2007a(Perpiñà et al, , 2010b, and external electrical dysfunctions occur (Malagoni-Buiatti et al, 2010).…”

Section: Failures Of Semiconductor Power Devices In Railway Traction mentioning

confidence: 99%

“…9), simultaneously cooling down two legs of one power inverter (two modules per side). This cooling solution is used in railway inverters belonging to the power range from 500 kW to 1000 kW (medium power range), in which the power dissipation requires higher cooling performances than dry panels cooled by air-forced convection, but lower than water pumping-based cooling systems (Baumann et al, 2001). Fig.…”

Section: Thermosyphon Cooling System Descriptionmentioning

confidence: 99%

“…The motor is represented by three inductive loads interconnected to the nodes between IGBT modules. Aside from IGBT modules, they also include a cooling system (based on air-forced convection, heat-pipes or liquid pump technologies) (Bouscayrol et al, 2006;Baumann et al, 2001), bus-bar high power connections, a close control command or IGBT drivers for switching them (Steimel, 2004;), low voltage connections, capacitors (decoupling or filtering) (Malagoni-Buiatti et al, 2010), mechanical parts for support and connectors, and a control board and current sensors integrated in the IGBT module (Bose, 2006). Fig.…”

Section: Introductionmentioning

confidence: 99%

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Reliability and Lifetime Prediction for IGBT Modules in Railway Traction Chains

Perpiñà¹,

Navarro²,

Jordà³

et al. 2012

Reliability and Safety in Railway

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Modelling of a pin-fin heat converter with fluid cooling for power semiconductor modules

Khorunzhii

Gabor

Job

et al. 2003

Int. J. Energy Res.

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SUMMARYThis paper presents a way to design a finite-element computer model of cooling system with a complicated geometry. The computer model is developed on the basis of a commercial software package ABAQUS. The steady state forced-convective fluid cooling of a pin-fin heat converter for power ($1 kW heat power) semiconductor module has been investigated on the basis of computer simulation. A phenomenological equation has been used for calculation of the local value of the heat transfer coefficient for the liquid-solid interface. The impacts of the thermal conductivity of the pin-fin sink material, volume flow rate of the cooling liquid and geometrical design of the pin-fin sink on the thermal resistance of the converter are shown.

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Optimized cooling systems for high-power semiconductor devices

Cited by 17 publications

References 2 publications

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling

Reliability and Lifetime Prediction for IGBT Modules in Railway Traction Chains

Modelling of a pin-fin heat converter with fluid cooling for power semiconductor modules

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