Performance Analysis of Bump in Tapered TSV: Impact on Crosstalk and Power Loss

Chandrakar, Shivangi; Gupta, Deepika; Majumder, Manoj Kumar; Kaushik, Brajesh Kumar

doi:10.1109/ojnano.2022.3221815

Cited by 5 publications

(2 citation statements)

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“…The 3D integration provides large bandwidth, small foot print, reduced form factor and lower interconnect complexity over the two dimensional integration technologies. [9][10][11] The 3D technology attracted the semiconductor design engineers as it offers tremendous platform to attain more than Moore law. This brings heterogeneous materials such as Silicon (Si), II-V semiconductor and graphene, and technologies such as memories, optoelectronics, and logics on single chip.…”

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confidence: 99%

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Analysis of Crosstalk Effects for Ternary Logic MWCNT Bundled Through Silicon Vias

Basha¹,

Venkatramana²

2023

ECS J. Solid State Sci. Technol.

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We present a technique to improve the crosstalk effects in ternary coupled through silicon vias (TSVs). The effects of crosstalk were investigated in TSVs using multi-walled carbon nanotube (MWCNT) as metallic liner and polymers such as polyimide, polypropylene carbonate, and benzocyclobutene (BCB) as dielectric liners. The circuit model for coupled TSVs driven by a ternary inverter was utilized to analyze the various crosstalk issues. The HSPICE tool was utilized to develop the proposed TSVs. The crosstalk issues for the MWCNT TSVs were investigated and compared to single-walled CNT (SWCNT) TSVs. Moreover, the power, power delay product, and energy delay product were analyzed and compared to SWCNT TSVs. All of the performances were also studied for different TSV pitches. The coupled TSVs with BCB showed high performance for the large pitch values. Moreover, it was noted that the coupled TSVs with BCB at 5000μm TSV pitch improved the performance up to 40.03% over the SWCNT TSVs.

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“…The TSVs plays a major role by supplying the current. 9,12 The TSVs are metal liners surrounded with the dielectric liner that is placed in silicon. The performances of 3D IC are depends on the metal liner utilized in the TSVs.…”

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confidence: 99%