Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages

Circularly Polarized Millimeter-Wave Antenna Using 0-Level Packaging

“…9 and a loss tangent of 0.003 . The 0-level packaging process using benzocyclobutene (BCB) adhesive bonding [13] and a Pyrex Corning 7740 technology [14], presenting respectively excellent electrical properties, is employed. The substrate packaging is a thick glass substrate m , "Pyrex Corning 7740," with a dielectric constant of 4.…”

A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications

“…Silicon [2], glasses [1,3], and LTCC [4] have been frequently used as capping substrates. It was reported that Pyrex glass is suitable for low cost wet-etching technology and that it is compatible with RF applications [5]. One strong adhesive-bonding candidate is a photo-patternable polymer benzocyclobutene (BCB) chosen for its minimal outgassing, low moisture uptake and excellent electrical properties [6,7], and its flow characteristics during the bonding process provide good sealing for signal feed-throughs [3,10].…”

Integrated chip-size antennas for wireless microsystems: Fabrication and design considerations

“…Wafer-level packaging (WLP) techniques, based on MEMS technology, when applied to packaging of RF silicon ICs represent truly added value as at a limited cost 3D passive structures can be realized. Application of adhesive wafer bonding and through-wafer electrical via formation, allows stacking of different substrates together with silicon [3]. The use of glass wafers reduces the losses, but since typical glass substrates have dielectric constant in the range of 4-6.5, patch-type antennas would be rather large.…”