Recognition and Imaging of Point Defect Diffusion, Recombination, and Reaction During Growth of Czochralski-Silicon Crystals

Abstract

The behavior of point defects was visualized in lightly and heavily boron (B)-doped Czochralski-silicon (CZ-Si) crystals by employing a special growth technique, namely, rapidly cooling a growing crystal after it is detached from the Si melt. In the case of crystal growth with a high pulling rate, an anomalous oxygen precipitation (AOP) region dominated by vacancies appeared, whereas in the case of crystal growth with a low pulling rate, a dislocation loop region dominated by self-interstitials appeared. In the crystals cooled rapidly after halting growth for several hours, self-interstitials flowed into the AOP region and dislocation loop regions formed and expanded, while the AOP region shrunk due to diffusion of excess vacancies to the crystal surface and void regions. These transient changes in the point defect distribution were reproduced using a point defect simulator. Defect regions related to self-interstitials could not be confirmed in the heavily B-doped crystals with resistivities of 10 mΩcm or less, where the void- and oxidation-induced stacking fault (OSF)-ring regions disappeared completely at the center of the crystal. These results show that the behaviors of point defects in heavily doped CZ-Si crystals with various impurities are important research subjects in relation to future advanced power applications.

Surface Defect Classification in Silicon Wafer Manufacturing Using the Linear-Based Channeling and Rule-Based Binning Algorithms

“…They are captured as non-cleanable light point defects (LPDN) on the wafer surface by the scanning surface inspection systems (SSIS). These defects have the greatest negative impact on the device performance -for example, they lead to gate-oxide-integrity failure [3][4][5].…”