Selective patterning and scribing of Ti thin film on glass substrate by 532 nm picosecond laser

Abstract

In this paper, the feasibility of Ti film coated on glass substrate scribed via a 532 nm picosecond laser is investigated. Laser irradiations from the film side and from the transparent substrate side are performed for comparison. Optical microscopy, SEM, surface stylus and contact resistance measurement reveal that the Ti film can be completely removed with no damage to the glass substrate, using optimized process parameters. The complete removal threshold for the film for front-side scribing is found at 120 mJ/cm 2 , while the minimum laser fluence for complete scribing is 70 mJ/cm 2 in the case of back-side scribing. The lines scribed from the front side exhibit obvious thermal effects such as heat affected zones, burr and micro cracks. Backside scribing exhibits non-thermal behavior, which also can increase the process speed for the scribing of a Ti film on glass to 1000 mm/s. This makes the back-side laser scribing of Ti film a promising technique.

Thermodynamic effects of pulsed laser multilayer thin film etching

“…It is normally composed of a non-metallic substrate and a metal film with a special periodic pattern on the substrate, which is mainly processed by laser etching [2][3][4] . Yung studied the laser etching processes of Ti films on Ni-Cu metal/ceramic and glass substrates and found that nondestructive metal film removal can be achieved by adjusting the laser parameters [5] . However, the research was only performed for simple grooves, and no in-depth study on the processing accuracy and efficiency has been carried out.…”