Soft Defect Localization (SDL) on ICs

Abstract

We have developed a new scanning laser microscopy methodology, Soft Defect Localization (SDL), that directly locates soft defects from the front side and backside of an IC. The method combines localized laser heating with the pass/fail state of a device to successfully localize soft defects. Subtle, thermally sensitive soft defects can be localized by careful selection of the IC voltage, temperature, and operating frequency. Several examples are shown.

Pushing Failure Mode Stimulus to Overcome the Limitations and Boundaries of Soft Defect Localization Tools

“…SDL has been proven to be an effective fault localization technique utilized for "soft defect" types of failures. Soft defects are failures that are failing at some conditions but still passing at other conditions and are typically temperature and/or voltage sensitive [1]. This technique utilizes Scanning Laser Microscopy (SLM) to induce localized heating into the Device Under Test (DUT).…”

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Temperature dependent failures are some of the most challenging cases that will be encountered by the analyst. Soft Defect Localization (SDL) is a technique used to analyze such temperature-dependent, 'soft defect' failures [1]. There are many literatures that discuss this technique and its different applications [2][3][4][5][6][7].

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