“…Introduction of silicide or pure-metal as Schottky source/drain materials may lower the sub-sequent annealing temperature after high-k film deposition and can avoid the high-k film degradation due to high-temperature process [13]. On the other hand, in the case of conventional MISFETs with pn-junction source/drain, it is pointed out that current drivability is significantly degraded due to FIBS in the case that high-k gate di-electrics are adopted [14]. Considering that current drivability of Schottky barrier source/drain transistors is strongly affected by a potential profile around source/ channel junction, it is foreseen that their current drivability is strongly influenced in the case of devices with high-k gate dielectrics.…”