2011
DOI: 10.1016/j.mee.2010.12.106
|View full text |Cite
|
Sign up to set email alerts
|

Spray coating of PMMA for pattern transfer via electron beam lithography on surfaces with high topography

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
15
0

Year Published

2012
2012
2023
2023

Publication Types

Select...
9
1

Relationship

0
10

Authors

Journals

citations
Cited by 26 publications
(15 citation statements)
references
References 6 publications
0
15
0
Order By: Relevance
“…8 The spray coating method is particularly suitable for sharp substrate features including deep trenches, but it requires special spray coating equipment and a complex optimized mixture of PMMA with acetate and ketone to facilitate vaporization during the coating process. 5 Thermal evaporation of polystyrene (PR) has been recently used in ebeam lithography to achieve 15 nm resolution, but generally, PR has poor exposure sensitivity compared to PMMA and thermal evaporation equipment adds complexity and cost to the process. Ice resist has been applied to fragile and nonplanar substrates such as carbon nanotubes, but this method requires specially designed e-beam lithography and e-beam evaporation systems to maintain the temperature < 120 K, 8 thereby increasing cost and limiting the selection of target substrates.…”
Section: Facile Electron-beam Lithography Technique For Irregular Andmentioning
confidence: 99%
“…8 The spray coating method is particularly suitable for sharp substrate features including deep trenches, but it requires special spray coating equipment and a complex optimized mixture of PMMA with acetate and ketone to facilitate vaporization during the coating process. 5 Thermal evaporation of polystyrene (PR) has been recently used in ebeam lithography to achieve 15 nm resolution, but generally, PR has poor exposure sensitivity compared to PMMA and thermal evaporation equipment adds complexity and cost to the process. Ice resist has been applied to fragile and nonplanar substrates such as carbon nanotubes, but this method requires specially designed e-beam lithography and e-beam evaporation systems to maintain the temperature < 120 K, 8 thereby increasing cost and limiting the selection of target substrates.…”
Section: Facile Electron-beam Lithography Technique For Irregular Andmentioning
confidence: 99%
“…Several resist coating methods for unconventional substrates have been demonstrated, including ice lithography, , evaporative resists, , spray coating, spin coating using low-viscosity resists, , float coating, and dip coating . In ice lithography, water ice deposited on substrates is used as an e-beam resist.…”
Section: Introductionmentioning
confidence: 99%
“…However, standard spin-coating technique fails to pattern non-planar surfaces and cannot cover pre-structured substrates with resist uniformly. A possible solution is offered by alternative methods of resist deposition, such as resist evaporation [4], spray coating [5] or ice (H 2 O) lithography [6]. Nevertheless, these are mostly laborious processes and require special equipment.…”
Section: Introductionmentioning
confidence: 99%