Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking

Khong, Chee Houe; Yu, Aibing; Zhang, Xiaowu; Kripesh, V.; Pinjala, D.; Kwong, Dim‐Lee; Chen, Scott; Chan, Chien-Feng; Chao, Chun-Chieh; Chiu, Chi-Hsin; Huang, Chi Yen; Chen, Carl

doi:10.1109/eptc.2009.5416481

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Sub-modeling technique for thermo-mechanical simulation of solder microbumps assembly in 3D chip stacking

Cited by 5 publications

References 4 publications

Heterogeneous Integration of Chip-to-Chip Stacks

Heterogeneous Integration of Chip-to-Chip Stacks

Improving package assembly process yield for complex high density flip chip applications

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

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