1998
DOI: 10.1557/jmr.1998.0068
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Surface precipitates on single crystal LiNbO3 after dry-etching by CHF3 plasma

Abstract: The CHF3 electron cyclotron resonance (ECR) plasma etched LiNbO3 (LN) surface was analyzed chemically and crystallographically to investigate the dry-etch machining process for LN crystal, which was recently needed to obtain broader-band optical modulators. The etched surface was entirely covered with amorphous-like precipitates having ~70 nm diameter. These precipitates (or a part of them) were thought to be LiF from Auger electron and x-ray photoelectron spectroscopy. The results indicated that the LiF was f… Show more

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Cited by 16 publications
(9 citation statements)
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“…[4][5][6] The etching gas in the process chamber and the metal mask deposited on the LiNbO 3 for the etching process consisted of a C 3 F 8 /Ar gas mixture and a nickel film, respectively. Z-cut LiNbO 3 wafers, 1 mm in thickness and 3 in.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…[4][5][6] The etching gas in the process chamber and the metal mask deposited on the LiNbO 3 for the etching process consisted of a C 3 F 8 /Ar gas mixture and a nickel film, respectively. Z-cut LiNbO 3 wafers, 1 mm in thickness and 3 in.…”
Section: Methodsmentioning
confidence: 99%
“…The thickness of the Ti layer was about 100 nm. 4,7 The influence of the annealing of the etched ridge structure waveguide is shown in Figs. The Ti diffusion temperature was 1050°C.…”
Section: Methodsmentioning
confidence: 99%
“…The origin for the extrinsic contaminants was previously investigated and found to be precipitation of LiF and polymers, possibly due to the etching gases ͑CHF 3 and CF 4 ͒. 8,9 In particular, the LiF precipitates were found to be crystalline in the CF 4 etching, while amorphous in the CHF 3 etching. 9 Presumably, the ex- istence of such plasma species as HF in the ECR plasma affects the structure of the deposits.…”
Section: B Chemical Deterioration Of Etched Surfacementioning
confidence: 99%
“…Generation of LiF precipitates on the etched surface, as recently reported by us, may have been the cause of the problem in the device fabrication processes. 8,9 The purpose of this article is to investigate and clarify such problems occurring in the fabrication of high speed LN modulators with ridge waveguides. A possible solution can be proposed for some of these problems.…”
Section: Introductionmentioning
confidence: 99%
“…Finally, we removed the resist and Ti film using RIE. Fluorocarbons, such as CF 4 and CHF 3 , are generally used as etching gasses for LN etching [5], but the etching rate of LN is lower than ≈ 100 nm/min, due to the deposition of lithium fluoride (LiF) or carbon precipitates on the etched surface during the process [6]. We used a C 4 F 8 /Ar gas mixture for the etching [7,8].…”
Section: Introductionmentioning
confidence: 99%