The PCB level ESD immunity study by using 3 dimension ESD scan system

Wang, K.; Pommerenke, David; Zhang, Jian Min; Chundru, R.

doi:10.1109/isemc.2004.1349812

Cited by 25 publications

(5 citation statements)

References 1 publication

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“…The practical implementation of (8) to estimate RS requires knowledge of the coupling length for each field component. They have a major influence on the estimated susceptibility level as it appears not only explicitly in (7) and (8), but also implicitly in (6) for the calculation of the average E or H-fields produced by the injection probe. The coupling lengths are not known from the outset and their extraction relies on the NFSI maps built from NFSI test results.…”

Section: B Practical Implementation Of the Estimation Methodsmentioning

confidence: 99%

“…EAR-field scan immunity (NFSI) [1] is a powerful diagnostic tool that reveals coupling areas at the integrated circuit (IC) and printed circuit board (PCB) levels, and that helps electromagnetic compatibility (EMC) experts and designers to identify the root-cause of failures that may trigger during radiated susceptibility (RS) tests. In part I of this twopart paper, several examples of NFSI applications were presented [2]- [8]. This research work aims at providing postprocessing methods of NFSI results in order to assess RS risks at the IC and PCB levels.…”

Section: Introductionmentioning

confidence: 99%

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On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

Boyer

Nolhier

Caignet

et al. 2022

IEEE Trans. Electromagn. Compat.

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The work presented in this two-part paper focuses on a prediction method of the radiated susceptibility of integrated circuit and printed circuit board from near-field scan injection, in order to anticipate risks of non-compliance due to design weakness. In Part I, a worst-case estimator of the far-field induced voltage on a PCB trace was proposed. Based on it, an estimator of the radiated susceptibility of a printed-circuit board based on near-field scan results is derived and validated through two validation case studies.

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Section: B Practical Implementation Of the Estimation Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

Boyer

Nolhier

Caignet

et al. 2022

IEEE Trans. Electromagn. Compat.

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show abstract

“…There it induces voltages and currents. These voltages or currents may cause bit-errors, wrong instructions, or even a system crash [2]. There is limit to solving ESD failure problems resulting out of the foregoing causes mentioned earlier with artwork design or ESD protection devices.…”

Section: Introductionmentioning

confidence: 95%

ESD field coupling study in relation with PCB GND and metal chassis

Lee

Pommerenke

Lim

et al. 2009

2009 20th International Zurich Symposium on Electromagnetic Compatibility

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This work demonstrates a simple experimental setup to measure ESD-induced voltage to traces on a printed circuit board when ESD current is injected directly onto the outside of a metal case and presents how the induced voltage can be affected by the physical structure of the PCB ground and the metal case.The correlation between ESD-induced voltage and the method of connecting the PCB and chassis grounds shall be discussed, as well as how the PCB ground fill affects ESD. These experimental results may provide guidance for a better design for ESD immunity.

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“…The system may continue to operate without any issues following an ESD incident, or strained systems may undergo soft failure and resume normal operation after rebooting with or without human action [6,8]. The system may potentially sustain a hard failure because of heat effects, dielectric breakdown, or a combination of the two [9][10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Fields Radiated by Electrostatic Discharges: A Review of the Available Approaches

Fotis

2023

Electronics

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Electrostatic discharge (ESD) is a physical phenomenon that may destroy electronic components due to its high discharge current that may reach a few amperes in just a few ns. However, another major aspect of ESD is the related high-frequency electromagnetic (E/M) fields radiated by the ESD event. The electronic equipment that is affected by the ESD phenomenon is additionally affected by the induced voltages caused by these E/M fields. This is the reason that the current version of the IEC 61000-4-2 on ESD has a special reference to these fields and the measurement setup. Starting with the classical formulation of these fields, this paper reviews the most popular techniques for calculating the ESD electromagnetic fields while also emphasizing the best methods for minimizing computational effort. There is also a separate section for the measurement techniques that have been applied in research works, whose outcomes could be implemented in the next revision of the IEC 61000-4-2. It is extremely important for the next revision to include these measurement setups and the E/M field sensors because the ESD generators should comply with certain values related to the E/M fields they produce.

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The PCB level ESD immunity study by using 3 dimension ESD scan system

Cited by 25 publications

References 1 publication

On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

On the Correlation Between Near-Field Scan Immunity and Radiated Immunity at Printed Circuit Board Level – Part II

ESD field coupling study in relation with PCB GND and metal chassis

Electromagnetic Fields Radiated by Electrostatic Discharges: A Review of the Available Approaches

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