“…26,49 Numerous studies investigated the thermal stability of Mo-Si MLs that operate in the EUV region. 38,[50][51][52][53][54][55][56][57][58][59] The MLs were exposed to high temperatures either to study the kinetics of silicide formation, [60][61][62] to control the growth and optimize ML fabrication, 52,54,62,63 or to reduce stress in the MLs. 55,56,64,65 Structural changes in Mo-Si MLs due to increased temperature are of great importance for lithography applications due to the stringent requirements for reflectance and wavelength stability and figure errors due to stress changes in the MLs.…”