Thermally optimised millimeter wave package on an LTCC ceramic board

Sommer, J.-P.; Michel, B.; Goebel, U.; Jelonnek, J.

doi:10.1109/itherm.2000.866847

Cited by 14 publications

(6 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The FE analysis has gained importance also in design support for electronic components (Sommer et al 2000a(Sommer et al , 2000b(Sommer et al , 2002(Sommer et al , 2003Sommer 2004). Based on a complete description of geometry, loading, and material parameters, displacement fields (in thermo-mechanical cases) and temperature (in thermal cases) are calculated primarily which are the basis for derived quantities (strains and stresses, or heat fluxes, respectively) and the comparison with ultimate strength parameters for materials and interfaces.…”

Section: Fe-methodologymentioning

confidence: 99%

Thermo-mechanical analysis of advanced electronic packages in early system design

et al. 2005

View full text Add to dashboard Cite

The thermal and thermo-mechanical behaviour of advanced electronic packages should be taken into account from the initial design phase in order to achieve a high level of reliability. Numerical studies by means of finite element (FE) analyses are very useful in order to reveal and evaluate the essential thermal and mechanical influences which are induced during manufacturing, storing, transport, and operation. Two different types of packages are under investigation, an RF-system on chip including digital and analogue parts on one chip (RF SoC), and combined in a BGA-type package, made by Shellcase Ltd, and a power transistor with all contacts on one side. Parametric FE analyses are presented in order to pre-optimise the shape of the interconnects and to improve the compliance between stiff components before prototyping and real testing

show abstract

Section: Fe-methodologymentioning

confidence: 99%

Thermo-mechanical analysis of advanced electronic packages in early system design

et al. 2005

View full text Add to dashboard Cite

show abstract

“…In high power applications, such as microwave amplifier packages, the low thermal conductivity of LTCCs may considerably affect the reliability of the device performance. A common method to improve thermal dissipation is to use a heat spreader, but a more advantageous alternative provided by LTCC technology is to place metallic via arrays under high power components [29].…”

Section: High Thermal Conductivitymentioning

confidence: 99%

Low Temperature Cofired Ceramics

Sebastian

2008

Dielectric Materials for Wireless Communication

View full text Add to dashboard Cite

“…The FE analysis has gained importance also in design support for electronic components [4][5][6][7][8].…”

Section: Finite Element Analysis and Designmentioning

confidence: 99%

Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Sommer

Michel

Ostmann

2006

2006 1st Electronic Systemintegration Technology Conference

Self Cite

View full text Add to dashboard Cite

In order to achieve highfunctionality and reliability and to minimise the number oflater redesign loops, thermal and thermo-mechanical reliability aspects should be taken into account alreadyfrom the beginning ofthe initial design phase ofnew products orfo rdeveloping ofa new technology. For this purpose, numerical studies by means offinite element (FE) analyses are very efficient to check the desiredproperties.Within the research project "Hiding Dies ", funded by the European Commission, several packages with hidden dies are under construction. A special test board with different thermal test chips (TTCs) was designed regardingpredicted thermal as well as thermo-mechanicalproperties. The authors outline their experience in supporting the design process ofpackages with buried dies. It proved to be important to combine technological knowledge, experience in FEA, and a sufficiently quick response time. IntroductionInnovative electronic portable products can be characterised by increasing signal frequencies and the demand on higher density of functions, which requires more space, for active components as well as for passives. One way to meet these requirements is a three-dimensional integration of components. The authors follow a so-called "chip in polymer" approach, introduced by Fraunhofer IZM and TU Berlin [1]. It allows an extremely dense integration and very short interconnects, necessary for applications in the GHz-range. Thinned Si-components are embedded directly into the printed circuit boards, and the interconnects are realised by laser drilling and galvanic metallisation.The basic interconnect structure, which is neither a flip chip nor a wirebond, is shown in Fig. 1.

show abstract

Thermally optimised millimeter wave package on an LTCC ceramic board

Cited by 14 publications

References 2 publications

Thermo-mechanical analysis of advanced electronic packages in early system design

Thermo-mechanical analysis of advanced electronic packages in early system design

Low Temperature Cofired Ceramics

Electronic Assemblies with Hidden Dies - Design Support by Means of FE Analysis

Contact Info

Product

Resources

About