Articles you may be interested inPerformances by the electron optical system of low energy electron beam proximity projection lithography tool with a large scanning field Electron optical image correction subsystem in electron beam projection lithography Electron beam direct-write lithography systems are capable of meeting the resolution requirements of all future ITRS nodes and have a significant cost of ownership advantage over masked technologies, but these systems typically have very poor throughput due to space charge limitations. Ion Diagnostics has developed a multicolumn, multibeam (MϫM™) direct-write system that circumvents the space charge limitations by spreading the electron current over the wafer. The resulting lithography system can achieve critical dimensions of less than 100 nm with production throughputs greater than 60 wafers per hour, independent of wafer size. In this article we describe the electron optical column used in this system. We have developed a novel, microfabricated electron gun that produces 32 parallel electron beams that are individually controlled and blanked and contain deflectors that allow the gun optics to act as a perfect lens. Each column is 2 cm ϫ2 cm and can align and scan the 32 beams in parallel on the wafer. The wafer voltage is typically held at 50-100 kV, and backscattered electrons are collected for imaging and alignment information. Theoretical results and some performance results for a prototype column are presented.

In this paper, we present novel micro-electro-mechanical systems (MEMS) devices for unique probe recording technology, where the 1-D cantilever probe array approach requires a small number of cantilever probe tips for a large media platform and hence has higher reliability. The probe storage system is composed of three key MEMS devices: MEMS XYstage, linear motor and 1-D cantilever probe array with integrated heater. The design and fabrication process of three MEMS devices are given with prototypes. Their performances are discussed with the experimental results. The compact MEMS XY-stage device can be driven with ±20 lm movement, in X-and Ydirections. The miniature linear motor is smoothly driven to move back and forth at the speed of 20 mm/s and step of 150 lm by 150 mA pulse driving current. The indented (writing) bit size of 100 nm on polymer media is achieved by the prototyped cantilever probe tip with integrated heater.

No abstract

A nondestructively patterned silicon substrate serves as an ideal support for forming high-quality optical structures or devices. A new approach was proposed for fabricating site-controlled structures without destruction on a monocrystalline silicon surface via local anodic oxidation (LAO) and two-step postetching. The nondestruction was demonstrated by conductivity detection with conductive atomic force microscopy (AFM), and an almost perfect crystal lattice was observed from the fabricated hillock by high-resolution transmission electron microscopy (HRTEM). By programming AFM tip traces for LAO processing, site-controlled nondestructive patterns with different layouts can be produced. This approach provides a new route for realizing nondestructive optical substrates.

Friction-induced selective etching by TMAH solution was proposed for patterning a silicon surface with site control, high flexibility and low cost.