No abstract

Phase change memory devices were originally reported by S. R.Ovshinsky [1] in 1968. A 256-bit phase-change memory array based on chalcogenide materials was reported in 1970 [2] Recent advances in phase change materials, memory device designs, and process technology have resulted in significant advances in phase change device performance, and a new memory device, called Ovonic Unified Memory (OUM), has been developed. This paper will discuss various device and materials characteristics of OUM phase change memory materials of interest in applications for nonvolatile high-density memories. These materials are generally Te chalcogenide based, exploiting the congruent crystallization of the FCC phase and the associated reduction in resistivity that results from crystallization from the quenched amorphous state. Data storage is a thermally initiated, rapid, reversible structural phase change in the film. While rewriteable DVD disks employ laser heat to induce the phase change and modulate reflectivity, OUM technology uses a short electrical current pulse to modulate resistivity. The device geometry and thermal environment dictate the power and energy required for memory state programming.

No abstract

We have demonstrated conformal deposition of amorphous GeSbTe films in high aspect ratio structures by MOCVD. SEM analysis showed the as-deposited GeSbTe films had smooth morphologies and were well controlled for void free amorphous conformal deposition. GeSbTe films adhere well to SiO2, TiN, and TiAlN. The morphology and adhesion are stable in 420°C post process. By annealing at 365°C, amorphous GeSbTe films converted into crystalline GeSbTe with polycrystalline grain sizes of 5nm. Film resistivity in the crystalline phase ranged from 0.001 to 0.1 Ω-cm, suitable for device applications. Phase change devices fabricated with confined via structures filled with MOCVD GeSbTe showed cycle endurances up to 1×1010 with a dynamic set/rest resistance of two orders of magnitude.

We report on the first polycrystalline-silicon (poly-Si) thinfilm transistor (TFT) deposited at low temperature on Corning 7059 glass. It has immediate practical applications for low-cost thin-film display and imaging electronics manufacturing. All the process steps used to fabricate the poly-Si device occurred at temperatures of 550°C or less. The poly-Si films exhibit crystallite grain sizes on the order of 5000 A, and the fabricated devices have shown field-effect mobilities of 10-20 cm2/V-s and threshold voltages around zero. We have also developed a novel plasma process to form the source and drain contacts.