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Abstract-Throughout its history, from the early four-circuit gate-array chips of the late 1960s to today's billion-transistor multichip module, IBM has invested in tools to support its leading-edge technology and high-performance product development. The combination of demanding designs and close cooperation among product, technology, and tool development has given rise to many innovations in the electronic design automation (EDA) area and provided IBM with a significant competitive advantage. This paper highlights IBM's contributions over the last four decades and presents a view of the future, where the best methods of multimillion gate ASIC and gigahertz microprocessor design are converged to enable highly productive system-on-a-chip designs that include widely diverse hardware and software components.

AbstTact-In this paper, we study the requirements for interconnect in deep-submicron technologies and identify critical factors that will require innovations in process technology, process integration and circuitand-system design techniques. We also propose a scaling scheme for global lines to optimize the interconnect for a given application domain such as microprocessors, ASIC's or memory. For local interconnect we demonstrate that cross-talk is the major challenge which can be addressed by selectively using larger drivers to reduce cross-talk noise when necessary.

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