A 16-element phased-array receiver has been developed for advanced W-band automotive radars. The phased-array receiver is based on a single SiGe chip with RF beamforming capabilities, which is packaged using low-cost bond-wire techniques and attached to a 16-element linear microstrip array. The antenna results in a directivity of 29.3 dB and a gain of 28.0 dB at 77-81 GHz, and can be scanned to 50 in the azimuth plane in 1 steps. The packaging details are presented together with the steps taken to ensure a wideband impedance match and low coupling between the phased-array channels. Gain measurements done at 79 GHz agree well with simulations. The 16-element phased array receiver was used with a 2-element frequency-modulated continuous-wave transmitter at 76.5-77 GHz and high-resolution millimeter-wave images were obtained. The work shows that complex millimeter-wave phased arrays can be packaged using traditional bond-wire techniques, and can be a powerful solution for advanced automotive radars.

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This paper presents a CMOS amplifier-multiplier-antenna array capable of generating an EIRP of 3-4 dBm at 420 GHz. The chip is built using a 45-nm CMOS SOI process, and efficient on-chip antennas are used to extract the power out of the chip. The design is based on a 90-110 GHz distribution network with splitters and amplifiers, and a balanced quadrupler capable of delivering up 100 W of power at 370-430 GHz. The amplifier-multiplier concept is proven on a 2 4 array, and it can be also scaled to any array using additional W-band splitters and amplifiers.