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We present the concept and experimental realization of polarization-induced bulk electron doping in III-V nitride semiconductors. By exploiting the large polarization charges in the III-V nitrides, we are able to create wide slabs of high density mobile electrons without introducing shallow donors. Transport measurements reveal the superior properties of the polarization doped electron distributions than comparable shallow donor doped structures. The technique is readily employed for creating highly conductive layers in many device structures. PACS numbers: 61.72.Vv,72.20.-i, 73.40.-c Doping in semiconductors has been a much researched topic. The traditional shallow 'hydrogenic' doping technique is very well understood and gainfully employed. A good understanding of the role of ionized dopant atoms on carrier scattering in semiconductors led to the concept of modulation doping, which improved low temperature carrier mobilities in quantum-confined structures by many orders of magnitude [1]. The last decade witnessed the emergence of the III-V nitrides as a wide bandgap semiconductor with the property of large embedded electronic polarization fields owing to the lack of inversion symmetry in the crystal structure [2],[3]. This property has been widely exploited to make nominally undoped two-dimensional electron gases (2DEGs) in AlGaN/GaN heterostructures, which had led to high-electron mobility transistors (HEMTs) with record high performance characteristics[4]. The 2DEG at the AlGaN/GaN interface of a III-V nitride heterostructure is formed to screen the polar-

Two schemes of nucleation and growth of gallium nitride on Si(111) substrates are investigated and the structural and electrical properties of the resulting films are reported. Gallium nitride films grown using a 10–500 nm-thick AlN buffer layer deposited at high temperature (∼1050 °C) are found to be under 260–530 MPa of tensile stress and exhibit cracking, the origin of which is discussed. The threading dislocation density in these films increases with increasing AlN thickness, covering a range of 1.1 to >5.8×109 cm−2. Films grown using a thick, AlN-to-GaN graded buffer layer are found to be under compressive stress and are completely crack free. Heterojunction field effect transistors fabricated on such films result in well-defined saturation and pinch-off behavior with a saturated current of ∼525 mA/mm and a transconductance of ∼100 mS/mm in dc operation.

An overview is presented of progress in GaN electronic devices along with recent results from work at UCSB. From 1995 to 2001, the power performance of AlGaN/GaN high electron mobility transistors (HEMT) improved from 1.1 to 11 W mm-1, respectively. The disadvantage of the low thermal conductivity of the sapphire substrate was mitigated by flip-chip bonding onto AlN substrates, yielding large periphery devices with an output power of 7.6 W. A variety of HEMT amplifier circuits have been demonstrated. The first AlGaN/GaN heterojunction bipolar transistor (HBT) was demonstrated in 1998, with a current gain of about 3. By developing the technique of emitter regrowth, a current gain of 10 was achieved in both GaN BJTs and AlGaN/GaN HBTs. A common emitter current gain cutoff frequency of 2 GHz was measured. Critical issues involved in the growth of high quality AlGaN/(AlN)/GaN heterostructures and GaN:Mg by metal-organic chemical vapour deposition (MOCVD) and molecular beam epitaxy (MBE) and the device fabrication are discussed.

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