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In this study, the high-speed deformation behavior of solder joints formed withPb-free Zn-Sn and commercial Pb-Sn alloys bonded on different substrateswas investigated by the ball impact test method. Overall, Zn-Sn jointsexhibited greater impact strength but inferior impact toughness than Pb-Snjoints. This can be ascribed to the high hardness of Zn-Sn solders resulting inpartial or overall interfacial fracture. In contrast, the joints with soft Pb-Snsolders all showed a ductile fracture feature. It is suggested that, for the jointsrevealing brittle fracture, the impact toughness (impact energy) increasedwith the plastic ability of interfacial intermetallic compounds, while for thoseshowing a ductile fracture mode, the impact energy deteriorated with ahardened solder matrix resulting from substrate dissolution

Coalescence of carboxylate-capped Ag nanoparticles can be achieved by soaking the deposits in ascorbic acid solution. Long-chain carboxylates are easier to remove. Conductive and bendable films can form on PDMS substrate using this method.

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