2001
DOI: 10.1143/jjap.40.419
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Advanced Micro-Lithography Process with Chemical Shrink Technology

Abstract: We have developed an advanced micro-lithographic process for producing 0.1 µm contact holes (CH). A chemical shrink technology, resolution enhancement lithography assisted by chemical shrink (RELACS) utilizes the cross-linking reaction catalyzed by the acid component existing in a predefined resist pattern. This “RELACS” process is a hole shrinking procedure that includes simple coating, baking, and rinse steps applied after conventional photolithography. We evaluated the dependency of CH shrinkage on resist f… Show more

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Cited by 17 publications
(14 citation statements)
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“…Several resolution enhancement techniques applied after conventional lithographic procedures have been reported to have excellent feasibilities to overcome the limit, including the thermal flow process, 1,2) the shrink assist film for enhanced resolution (SAFIER) process, 3,4) and the resolution enhancement of lithography assisted by chemical shrink (RELACS) process. 1,5) As illustrated in Fig. 1, the RELACS process is a pattern shrinking process applied after the patterning of chemically amplified (CA) resist.…”
Section: Introductionmentioning
confidence: 99%
“…Several resolution enhancement techniques applied after conventional lithographic procedures have been reported to have excellent feasibilities to overcome the limit, including the thermal flow process, 1,2) the shrink assist film for enhanced resolution (SAFIER) process, 3,4) and the resolution enhancement of lithography assisted by chemical shrink (RELACS) process. 1,5) As illustrated in Fig. 1, the RELACS process is a pattern shrinking process applied after the patterning of chemically amplified (CA) resist.…”
Section: Introductionmentioning
confidence: 99%
“…1) The RELACS process is a hole-shrinking process which involves spin coating, mixing bake, and rinsing steps applied after the conventional lithographic process. 4) This process is also called the chemical shrink technique. The RELACS film is formed at the spin coating step, and is composed of watersoluble polymers and crosslinkers.…”
Section: Introductionmentioning
confidence: 99%
“…Shrunken contact holes are revealed after the rinsing step. The RELACS process has been applied to i-line, 5) 248 nm, 4) 193 nm, 3) 157 nm, 1) and electron-beam 6) lithography. With the RELACS process, the last three of the lithographic technologies mentioned above are demonstrated to be capable of shrinking the contact holes down to sub-100nm regions.…”
Section: Introductionmentioning
confidence: 99%
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“…Recently, approaches based on thermal resist flow [1]- [3] and thermal cross-linking reaction on photo-resist sidewall [4], [5] are proposed for hole shrinkage. These approaches print the space or hole patterns at relatively larger dimension and then shrink them to smaller size.…”
Section: Introductionmentioning
confidence: 99%