1999
DOI: 10.1109/16.737434
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On-state and off-state breakdown in GaInAs/InP composite-channel HEMT's with variable GaInAs channel thickness

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1999
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Cited by 79 publications
(34 citation statements)
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“…Composite channels [34], [35], compositionally graded channels [36], and quantized channels [35] have all been investigated toward this goal, although longlasting benefit has not been obtained beyond 60 GHz. Cap recess engineering should also be an effective approach for improving .…”
Section: Options For Breakdown Voltagementioning
confidence: 99%
“…Composite channels [34], [35], compositionally graded channels [36], and quantized channels [35] have all been investigated toward this goal, although longlasting benefit has not been obtained beyond 60 GHz. Cap recess engineering should also be an effective approach for improving .…”
Section: Options For Breakdown Voltagementioning
confidence: 99%
“…The enhancement of power characteristics can be achieved by improving the current level or breakdown voltage of the HEMTs. A variety of methods have been used to increase the power performance of HEMTs these include the GaN/AlGaN material system [5,6], the gate-fieldplate technique [7,8], and the adoption of composite channel systems [9,10]. Most of these methods have focused on the enhancement of transistor power by increasing the breakdown voltage.…”
Section: ⅰ Introductionmentioning
confidence: 99%
“…On the other hand, as is decreased, the relative importance of II grows. This illuminates work on lightly doped devices which showed a dependence on channel composition and quantization, as well as signatures of II in breakdown [3], [6], [12].…”
Section: The Gate Current Ratio Measurementmentioning
confidence: 99%
“…The cause of this behavior is a subject of debate-it has been variously claimed that impact ionization (II), thermionic field emission (TFE), tunneling, or some combination thereof are responsible for off-state breakdown [2]- [6]. Furthermore, different devices may suffer from different breakdown mechanisms, depending on the details of the design (insulator thickness, recess, channel composition, and so forth).…”
Section: Introductionmentioning
confidence: 99%