2011
DOI: 10.1080/10584587.2011.575015
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Resistive Switching of SnO2 Thin Films on Glass Substrates

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Cited by 14 publications
(4 citation statements)
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“…The forming process was made twice before observing the resistive switching. This forming voltage for SnO 2 in this work is higher than the reported in reference [14] (4-5 volt) for other metals used with tin oxide, because of the larger area of the top electrode used in this work. As a result of the forming process the devices switched to low resistance state (LRS) i.e the resistance became (105 Ω) with a drop voltage of (0.4 V), this resistance stay at its low value until increasing the applied voltage to a value of range (0.68 -1.5 V) called Reset voltage with the same polarity a sudden drop of current is achieved and the resistance of the cell is switched to high resistance state (HRS) the current dropped to about (127-150 µA) (see table 3).…”
Section: 2-current -Voltage Characteristicscontrasting
confidence: 64%
“…The forming process was made twice before observing the resistive switching. This forming voltage for SnO 2 in this work is higher than the reported in reference [14] (4-5 volt) for other metals used with tin oxide, because of the larger area of the top electrode used in this work. As a result of the forming process the devices switched to low resistance state (LRS) i.e the resistance became (105 Ω) with a drop voltage of (0.4 V), this resistance stay at its low value until increasing the applied voltage to a value of range (0.68 -1.5 V) called Reset voltage with the same polarity a sudden drop of current is achieved and the resistance of the cell is switched to high resistance state (HRS) the current dropped to about (127-150 µA) (see table 3).…”
Section: 2-current -Voltage Characteristicscontrasting
confidence: 64%
“…Further, the memristive devices are fabricated on glass substrates, which have low thermal conductivities, compared to silicon substrates [15]. The glass substrates favor the diffusion of oxygen vacancies [16]. An improved resisting switching performance in terms of higher memory window (MW), better endurance characteristics and lower value of reset voltages are reported in various oxides, such as HfO x [15], SnO 2 [16], TaO x [17] and MoO 3 [18].…”
Section: Introductionmentioning
confidence: 99%
“…The glass substrates favor the diffusion of oxygen vacancies [16]. An improved resisting switching performance in terms of higher memory window (MW), better endurance characteristics and lower value of reset voltages are reported in various oxides, such as HfO x [15], SnO 2 [16], TaO x [17] and MoO 3 [18]. This work mainly focuses on the memristive devices which are fabricated on the silicon substrates.…”
Section: Introductionmentioning
confidence: 99%
“…2 However, in the case of stoichiometric or nonstoichiometric tin oxide (SnO x ), the hybridized orbitals and increased dispersion at the top of the valence band will lead to an enhancement in hole mobility. 6,7 However, to the best of our knowledge, there are few reports on RS behavior and its conduction mechanism of RRAM-based SnO x . 4 If an excess of oxygen atoms exist in SnO, SnO x is formed.…”
Section: Introductionmentioning
confidence: 99%