Material characterization of metal induced lateral crystallization (MILC) process of amorphous silicon (a-Si) has been performed by using the spreading resistance probe (SRP) measurements. It was found that carrier mobility in boron ion implanted layer, formed in MILC region, is up to 65 % in comparison with mobility in boron ion implanted layer, formed in single crystalline silicon. It was also observed in this work that prolongation of MILC process from 1 hour to 2 hours had induced the increasing of mobility from 24 cm2/Vs to 34 cm2/Vs.
Porous silicon layers formed on p+ substrates were investigated by secondary ion mass spectrometry technique. It has been found for the first time that the dopant impurity (boron) does not escape from the porous silicon (PS) layer during the anodization. Analysis of the boron excess in PS in relation to the crystalline substrate provides a means by which to study the porosity depth distribution. The resistivity of the PS layer has been observed to depend strongly on depth: in particular, in the high-porosity layers (50-65%) a relatively thin insulating sublayer (about 300 nm) is found to form at the surface. After annealing of the PS layers in an oxidizing atmosphere, the high-resistivity regions disappear.
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