The design, fabrication, and characterization of a novel low-frequency meandering piezoelectric vibration energy harvester is presented. The energy harvester is designed for sensor node applications where the node targets a width-to-length aspect ratio close to 1:1 while simultaneously achieving a low resonant frequency. The measured power output and normalized power density are 118 μW and 5.02 μW/mm(3)/g(2), respectively, when excited by an acceleration magnitude of 0.2 g at 49.7 Hz. The energy harvester consists of a laser-machined meandering PZT bimorph. Two methods, strain-matched electrode (SME) and strain-matched polarization (SMP), are utilized to mitigate the voltage cancellation caused by having both positive and negative strains in the piezoelectric layer during operation at the meander's first resonant frequency. We have performed finite element analysis and experimentally demonstrated a prototype harvester with a footprint of 27 x 23 mm and a height of 6.5 mm including the tip mass. The device achieves a low resonant frequency while maintaining a form factor suitable for sensor node applications. The meandering design enables energy harvesters to harvest energy from vibration sources with frequencies less than 100 Hz within a compact footprint.

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Abstract-A 43-GHz wireless inter-chip data link including antennas, transmitters, and receivers is presented. The industry standard bonding wires are exploited to provide high efficiency and low-cost antennas. This type of antennas can provide an efficient horizontal communication which is hard to achieve using conventional on-chip antennas. The system uses binary amplitude shift keying (ASK) modulation to keep the design compact and power efficient. The transmitter includes a differential to single-ended modulator and a two-stage power amplifier (PA). The receiver includes a low-noise amplifier (LNA), pre-amplifiers, envelope detectors (ED), a variable gain amplifier (VGA), and a comparator. The chip is fabricated in 180-nm SiGe BiCMOS technology. With power-efficient transceivers and low-cost high-performance antennas, the implemented inter-chip link achieves bit-error rate (BER) around 10 8 for 6 Gb/s over a distance of 2 cm. The signal-to-noise ratio (SNR) of the recovered signal is about 24 dB with 18 ps of rms jitter. The transmitter and receiver consume 57 mW and 60 mW, respectively, including buffers. The bit energy efficiency excluding test buffers is 17 pJ/bit. The presented work shows the feasibility of a low power high data rate wireless inter-chip data link and wireless heterogeneous multi-chip networks.Index Terms-Bond-wire antenna, high-speed link, on-chip antenna, wirebond antenna, wireless inter-chip link, wireless transceiver.

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