GaN based high electron mobility transistors (HEMTs) have demonstrated extraordinary features in the applications of high power and high frequency devices. In this paper, we review recent progress in AlGaN/GaN HEMTs, including the following sections. First, challenges in device fabrication and optimizations will be discussed. Then, the latest progress in device fabrication technologies will be presented. Finally, some promising device structures from simulation studies will be discussed.

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Based on 11-μm-thick silicon layer and 1-μm-thick buried oxide layer, a novel high-voltage thick layer SOI technology has been developed for driving plasma display panels (PDP). HV pLDMOS, nLDMOS, nLIGBT and LV CMOS are compatible with deep trench isolation. The length T, Y for HV pLDMOS and TD for HV nLDMOS are optimized to reduce the device size and satisfy the off-state breakdown voltage simultaneously. Interdigitated N + &P + and a deep P + are adopted in the source region of HV nLDMOS and cathode region of HV nLIGBT to suppress parasitic NPN action and gain better onstate characteristics. A PDP scan driver IC using the developed high-voltage thick layer SOI technology shows that the rise and fall times of the output stages are about 17.6 ns and 16.6 ns respectively.