No abstract

An effective resistive-switching effect has been observed in silicon nitride (Si 3 N 4 ) dielectrics in Ag/Si 3 N 4 /Al memory cells. The ratio of the low resistance to high resistance state was larger than 10 7 at ±1.2 V for a 10 nm thick Si 3 N 4 layer. This switching behavior is attributed to a change in the conductivity of the Si 3 N 4 dielectrics, depending on whether nitride-related traps are filled with electrons under positive biases or unfilled under negative biases. This assertion is experimentally confirmed from the relationship between the amount of charges trapped in the Si 3 N 4 layer and the corresponding changes in its resistance with respect to bias voltages. In addition, the formation or dissolution of the conductive path is confirmed by conductive atomic force microscopy current images.

The origin of the electron memory trap in an oxide-nitride-oxide structure deposited on n-type Si is investigated by both capacitance-voltage and deep level transient spectroscopy (DLTS). Two electron traps are observed near 0.27 and 0.54eV, below the conduction band minimum of Si and are identified as the nitride bulk trap and the Si–SiO2 interfacial trap, respectively. The trap depth, viz., vertical distribution of the electron trap, in both nitride bulk and Si–SiO2 interface, are also estimated from the bias voltage dependent DLTS.

The authors report a silicon-based one-diode–type resistive-switching memory (RRAM) device with self-rectifying properties and high electrical properties. The RRAM cell consisted of Al/Cr–SrTiO3/Si and revealed intrinsic diode properties, so that unwanted sneaky currents could be removed from an RRAM crossbar array without extra switching devices. The insulator–metal transition property of the proposed device was explained using the space-charge–limited conduction mechanism. The memory device showed good characteristics including high ON/OFF ratio (∼106), low reset current (∼10-11 A), high speed at low voltage (200 ns, 2 V), and reasonable endurance (>104 cycles) and retention characteristics (>104 s).

We examined the origin of the charge traps in bothSiO2/Si3N4/SiO2 (ONO) and Al2O3/Si3N4/SiO2 (ANO) structures and their effect on the memory characteristics by capacitance-voltage (C-V) measurements and deep level transient spectroscopy (DLTS). A larger memory window was observed by C-V for ANO, due to its higher trap density. The DLTS showed that nitride traps are dominant in ANO, while more Si/SiO2 interface-related traps are observed in ONO. The ANO capacitor outperforms the ONO one in terms of both the program efficiency and retention, which is attributed to the reduced number of interface traps in ANO.