ORMOSIL films: Properties and microelectronic applications

Abstract

Abstract. The properties, as well as some issues of microelectronic applications of organically modified silicate (ORMOSIL) films, prepared by cohydrolysis in various proportions of tetraethoxysilane (TEOS) and phenyltriethoxysilane (PTEOS), or diphenyldiethylhexyloxydiethoxydisiloxane (DPS) 1, are discussed. Keywords:organically modified silicates, thin film, refractive index, electrical properties Solution Preparation and Film Formation ProcessThe initial solutions were prepared by dissolving TEOS in n-butanol in the presence of some water and HC1. The equivalent SiO content was 6 wt.% and the molar ratio of components was The films were prepared by spinning on silicon wafers with a following bake at 150~ during 3 min (hot plate) and a final anneal at Ta = 200, 450 or 600~ during 20 min. Multiple application with the intermediate bake was used for thicker film preparation; (two-fold coatings were used for electrical measurements, and three-fold ones for IR spectra). Aluminum electrodes were formed by lithography process, for electrical measurements. IR SpectraIIR spectra of the films were measured with a PerkinElmer 1720 spectrometer in the range from 4000 to 400 cm -1 . IR spectra of the silicate films are typical of silicate materials prepared by sol-gel techniques and show the presence of hydroxyl groups. Modification of silicate with organic leads to the production of typical phenyl infrared bands, the magnitudes of which increase with increasing organic content (see Fig. 1). The IR spectra of the films prepared from PTEOS and C2H5

Synthesis of an adhesion‐enhancing polysiloxane containing epoxy groups for addition‐cure silicone light emitting diodes encapsulant

“…In this paper, the encapsulation materials samples 2, 3, and 4 in Table fabricated by sol‐gel condensation and thermal curing have higher refractive index of 1.546, 1.543, and 1.543, respectively, at a wavelength of 589 nm compared with that of a conventional epoxy encapsulant . The high refractive index originates from high polarizability of phenyl groups . Therefore, this prepared encapsulation material is a suitable material for application as an LED encapsulant to produce a white LED with high luminescence efficiency.…”

Thermal resistance of cycloaliphatic epoxy hybrimer based on sol‐gel derived oligosiloxane for LED encapsulation

“…Cycloaliphatic epoxy hybrimer bulk fabricated by sol‐gel condensation and thermal curing, meanwhile, has a higher refractive index of 1.55 at a wavelength of 632.8 nm compared to that of a conventional epoxy encapsulant 12, 13. The high refractive index of cycloaliphatic epoxy hybrimer bulk originates from high polarizability of phenyl groups in the cycloaliphatic epoxy hybrimer bulk 8. Therefore, cycloaliphatic epoxy hybrimer bulk is a suitable material for application as an LED encapsulant to produce a white LED with high luminescence efficiency.…”

“…Inorganic‐organic nanohybrid materials (hybrimers) based on sol‐gel derived oligosiloxane are candidate materials for the encapsulation of white LEDs due to their excellent transparency 5–7. Hybrimers are also optimal materials in terms of providing a high refractive index for high luminescence efficiency, because their refractive index is controllable according to their composition 8…”

Fabrication of Patterned Inorganic–Organic Hybrid Film for the Optical Waveguide by Microfluidic Lithography

“…Furthermore, one or more silicon to carbon bonds hinder the condensation reactions, resulting in lower shrinkage. 19,20 The optical transmittance spectrum of the ORMOSIL guiding layer coated on the quartz glass is shown in Fig. 2(B) and the sample was prepared from the precursor solution containing 33 mol% PhTMOS.…”