This paper presents a wide band compact high isolation microelectromechanical systems (MEMS) switch implemented on a coplanar waveguide (CPW) with three ohmic switch cells, which is based on the series-shunt switch design. The ohmic switch shows a low intrinsic loss of 0.1 dB and an isolation of 24.8 dB at 6 GHz. The measured average pull-in voltage is 28 V and switching time is 47 μs. In order to shorten design period of the high isolation switch, a structure-based small-signal model for the 3-port ohmic MEMS switch is developed and parameters are extracted from the measured results. Then a high isolation switch has been developed where each 3-port ohmic MEMS switch is closely located. The agreement of the measured and modeled radio frequency (RF) performance demonstrates the validity of the electrical equivalent model. Measurements of the series-shunt switch indicate an outstanding isolation of more than 40 dB and a low insertion loss of 0.35 dB from DC to 12 GHz with total chip size of 1 mm × 1.2 mm.

The study is performed to implement the Gold-Gold thermocompression bonding for the wafer-level packaging of MEMS chips. Numerous experimental attempts have been carried out to select the metal film adhesive to avoid the Au-Si melt together and optimize bonding processes to intensify the Au-Au eutectic bonding. Finally the results display that the eutectic bonding of the gold-gold are arrived as electrical as well as mechanical interconnection of the MEMS structure and as seal as well as bonding intension.

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The design and fabrication of MEMS capacitive differential pressure sensor is reported. Silicon membrane is used as movable electrode. Gold metal film on glass is used as fixed electrode. Anodic bonding is used to bond together the silicon and glass to form the capacitive pressure sensor. The measurement capacitance of the sensors is 5.37 pF at an applied pressure of 0 kPa and 7.26 pF and the full operating range of 40 kPa.The ratio of changed to initial capacitance was 0.35. The error of the MEMS capacitive pressure sensor is less than 4‰ full-scale(FS) by using quadratic curve fitting which can meet most application requirements.

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